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| SS8053G 1.5A Ultra Low Dropout Regulator FEATURES Fixed output voltages of 1.2/1.5/1.8/2.5/3.3V Output current up to 1.5A Over-current and over-temperature protection Low dropout voltage 500mV @ 1.5A Low ground current SOT-223 package DESCRIPTION The SS8053G is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1.5 Amps. The SS8053G features 500mV dropout voltages and very low ground current. Although designed for high current loads, these devices are also useful in lower current, extremely low dropout-critical systems, where their minimal dropout voltage and ground current values are important characteristics. The SS8053G provides excellent regulation over variations in line, load and temperature. APPLICATIONS Battery powered systems Motherboards Peripheral cards Network cards Set Top Boxes Notebook Computers Pb-free; RoHS compliant. ORDERING INFORMATION SS8053-xxGT6 XX PIN CONFIGURATION AND MARKING G953-XX G953-xx = SS8053-xxG Packing: TR: Tape and reel 1 YWWS DATE/LOT CODE: Y = year: H=2005, I=2006, J=2007, ... 3 2 WW = work week (01 -> 52) S = lot code sequence Output voltage: 12: 1.2V 15: 1.5V 18: 1.8V 25: 2.5V 33: 3.3V VIN GND VO TYPICAL APPLICATION CIRCUIT 3.3V VIN GND 22F VO 1.5V 47F 9/27/2006 Rev.1.01 www.SiliconStandard.com 1 of 3 SS8053G ABSOLUTE MAXIMUM RATINGS (Note 1) Input Voltage....................................................7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature......................150C Storage Temperature Range.........-65C (Note 1) Input Voltage.........................................2.2V ~5.5V Temperature Range......................-40C VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =10F, TA = TJ = 25C unless otherwise specified (Note 3) PARAMETER Supply Voltage Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current IQ VD SYMBOL VIN VO CONDITION VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 1.5A VIN=3.3V fi=120Hz, 1VP-P, IO=100mA IO=1.5A MIN 2.2 -2 ------------- TYP --VO 0.2 0.8 1.7 55 0.5 0.8 MAX 5.5 2 2 2 2.5 --0.65 --- UNIT V % % % mA dB V A Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, QJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / QJA. If this dissipation is exceeded, the die temperature will rise above 150C and the chip will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain the junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will still operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. 9/27/2006 Rev.1.01 www.SiliconStandard.com 2 of 3 SS8053G PHYSICAL DIMENSIONS SOT-223 (unit: mm) D B1 A SYMBOL MIN C MAX 13(4X) H E L e e1 L2 Taping Specification 13(4X) A1 B Feed Direction SOT-223 Package Orientation SYMBOL A A1 B B1 C D E e e1 H L L2 MILLIMETER MIN 1.55 0.02 0.60 2.90 0.24 6.30 3.30 2.30 BSC 4.60 BSC 6.70 0.90 MIN 0.06 BSC 0 10 0 7.30 0.264 INCH MAX 1.80 0.12 0.80 3.10 0.32 6.70 3.70 MIN 0.061 0.0008 0.024 0.114 0.009 0.248 0.130 0.090 BSC 0.181 BSC MAX 0.071 0.0047 0.031 0.122 0.013 0.264 0.146 0.287 0.036 MIN 0.0024 BSC 10 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 9/27/2006 Rev.1.01 www.SiliconStandard.com 3 of 3 |
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